{"product_id":"the-global-market-for-thermal-interface-materials-2023-2033","title":"The Global Market for Thermal Interface Materials 2023-2033","description":"\u003cp\u003eThe Global Market for Thermal Interface Materials 2023-2033\u003c\/p\u003e\n\n\u003cp\u003eThe effective transfer\/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.\u003c\/p\u003e\n\n\n\n\u003cp\u003eThermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. A range of Carbon-based, metal\/solder and filler-based TIMs are available both commercially and in the research and development (R\u0026amp;D) phase.\u003c\/p\u003e\n\n\n\n\u003cp\u003eReport contents include:\u003c\/p\u003e\n\n\u003cp\u003eAnalysis of recent commercial and R\u0026amp;D developments in thermal interface materials (TIMs).\u003c\/p\u003e\n\n\u003cp\u003eMarket trends and drivers.\u003c\/p\u003e\n\n\u003cp\u003eMarket map.\u003c\/p\u003e \n\n\u003cp\u003eAnalysis of thermal interface materials (TIMs) including:\u003c\/p\u003e\n\n\u003cp\u003eThermal Pads\/Insulators.\u003c\/p\u003e\n\n\u003cp\u003eThermally Conductive Adhesives.\u003c\/p\u003e\n\n\u003cp\u003eThermal Compounds or Greases.\u003c\/p\u003e\n\n\u003cp\u003eThermally Conductive Epoxy\/Adhesives.\u003c\/p\u003e\n\n\u003cp\u003ePhase Change Materials.\u003c\/p\u003e\n\n\u003cp\u003eMetal-based TIMs.\u003c\/p\u003e\n\n\u003cp\u003eCarbon-based TIMs.\u003c\/p\u003e\n\n\u003cp\u003eMarket analysis. Markets covered include:\u003c\/p\u003e\n\n\u003cp\u003eConsumer electronics.\u003c\/p\u003e\n\n\u003cp\u003eElectric Vehicles (EV) batteries.\u003c\/p\u003e\n\n\u003cp\u003eData Center infrastructure.\u003c\/p\u003e\n\n\u003cp\u003eADAS sensors.\u003c\/p\u003e\n\n\u003cp\u003eEMI shielding.\u003c\/p\u003e\n\n\u003cp\u003e5G.\u003c\/p\u003e\n\n\u003cp\u003eGlobal market revenues for thermal interface materials (TIMs), segmented by type and market, historical and forecast to 2033.\u003c\/p\u003e \n\n\n\n\u003cp\u003eProfiles of 87 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Shin-Etsu Chemical Co., Ltd, and SHT Smart High-Tech AB.\u003c\/p\u003e","brand":"Heavy Industry","offers":[{"title":"July, 2023 \/ 208 Pages \/ MCW16206779","offer_id":47608866406706,"sku":null,"price":1500.0,"currency_code":"USD","in_stock":true}],"url":"https:\/\/www.hardmanwell.com\/products\/the-global-market-for-thermal-interface-materials-2023-2033","provider":"HARDMAN AND WELL MANAGEMENT CONSULTANCIES L.L.C","version":"1.0","type":"link"}